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Product References

Sector: Avionics



Application: Test & simulation modules for VME bus
Printed circuit board: PCB 14-layer µVia (blind & buried vias)
Components / process: BGA & µBGA assembly

 


 



Application: Test & simulation modules for PMC
Printed circuit board: PCB 14-layer µVia (blind & buried vias)
Components / process: BGA & µBGA assembly
 


 

Sector: Rail engineering



Application: Dubai Metro display

 


 

Sector: Broadcasting



Application: Audio embedder
Printed circuit board: PCB 8-layer, metallised edges, 3 mm thick
Components / process: Sandwich of 3 assemblies, BGA, QFN
 


 



Application: Frame synchroniser
Printed circuit board: PCB 14-layer
Components / application: BGA > 1100 I/Os, QFN
 


 

Sector: Embedded computing



Application: COM Express with dual-core CPU
Printed circuit board: PCB 16-layer
Components / application: Double-sided BGA Assembly > 1000 I/Os

 


 

Sector: Industrial electronics



Application: ETX baseboard
Printed circuit board: PCB format 425 mm x 301.2 mm
 


 

Sector: Measuring technology



Application: Bus board
Printed circuit board: PCB 8-layer µVia
Components/process: 50-pin Micro-Speed ​​SMT/THR female connectors, protective coating
 


 



Application: Data input module
Printed circuit board: PCB 8-layer µVia
Components/process: Connectors 0.5 mm pitch, BGA assembly, protective coating

 


Sector: Telecommunications



Application: Access line backup
Services: Assembly production, box-build, configuration, retail logistics
 


 



Application: Access line backup
Services: Assembly production, box-build, configuration, retail logistics

 


Sector: Video surveillance



Application: Video surveillance
Services: Assembly production, box-build, configuration, retail logistics